[Discontinued Products]
CFP9350-0351F
EF-53
0.5mm Pitch FPC Connectors
RoHS Compliant
Specification
| Features | 1. Our original front flip lock structure ensures multi pins products of high level contact reliability. ・The structure which relieves the load from the cover when the FPC is locked will prevent detachment or breakage of the cover. ・There are no restrictions to the direction in which the FPC can be laid. 2. By turning the cover, an FPC can be connected easily with only a small force. 3. Low profile of 5.5mm height when mounted. 4. A small area with a 5.0mm width will contribute to a reduced PCB mounting area. 5. The contact area is located on the opposite side of the cover. 6. With a structure to prevent FPC failing off. 7. Using the ZIF structure. 8. Supplied in the embossed taping with automatic mounter. |
|---|---|
| Pitch | 0.5mm |
| Number of Pins | 50 |
| Contact | Opposite side of the cover |
| Mounting Style | SMT |
| FPC/FFC Insertion Direction | Vertical |
| Dimention | 5mm(W) × 30mm(D) × 5.5mm(H) |
| Mounting Height | 5.5mm |
| Applicable FPC/FFC Thickness | 0.3mm |
| FPC/FFC Connection | ZIF |
| Rated Voltage AC/DC | 50V AC/DC, 0.5A |
| Contact Resistance | (Initial)30mΩ Max. |
| Insulation Resistance | DC100V 100MΩ Min. |
| Withstanding Voltage | AC 100V (for one minute) |
| Operating Temperature Range | -40℃ to +85℃ |
| Packaging | Embossed Taping (2000 pcs / reel) |
Material and Plating
| Housing | Thermoplastic Resin |
|---|---|
| Cover | Thermoplastic Resin |
| Contact | Cu Alloy, Au Plating |
No applicable products
EF-53 Product List
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| ${item.field_kyoku_su} | ${item.field_seten} | ${item.field_fpc_ffc_sounyu} | ${item.field_jisso_takasa} | |||
Enquiry
Please feel free to contact us for product information and customization